Application Notes - Package & Thermal Management

Package & Thermal Management

Application Note	Product/Topic	Description - click on description below to view app note
AN-0953	Packaging	Assembly Guidelines for MicroFET 2X2 Packaging
AN-9057	Dual Power33	Assembly Guidelines for Asymmetric Dual Power33 Packaging
AN-9071SC	SPM®	Smart Power Module Motion-SPM™ in µMini DIP SPM® Thermal Performance Information (Chinese)
AN-9054	Power Stage Package	Assembly Guidelines for Power Stage 3x4.5mm Packaging
AN-5026	BGA	Using BGA Packages
AN-5054	aGeneral	Low Noise Leadless Packages Advance Portable Designs
AN-1025	SuperSOT	Maximum Power Enhancement Techniques for SuperSOT™-3 Power MOSFETs
AN-1026	SuperSOT	Maximum Power Enhancement Techniques for SuperSOT™-6 Power MOSFETs
AN-1028	SOT-223	Maximum Power Enhancement Techniques for SOT-223 Power MOSFETs
AN-1029	SO-8	Maximum Power Enhancement Techniques for SO-8 Power MOSFETs
AN-1032	SO-8	Performance Restrictions Associated with 3.5 Watts SO-8 Power MOSFETs
AN-6084	Suface Mount	Suface Mount Asssembly Guideline for WLCSP 1.0 x 1.5
AN-7001	BGA	Guidelines for Mounting Fairchild's BGA Packages
AN-7005	SO-8	Mounting Techniques for Bottomless™ SO-8
AN-7006	SO-8	Guidelines for Using Fairchild's SO-8 FLMP
AN-7516	aGeneral	Safe Operating Area Testing Without A Heat Sink
AN-7522	aGeneral	Using the Thermal Impedance Model
AN-7524	aGeneral	How to Determine Thermal Resistance for a Power Semiconductor Heat Sink in an SMPS
AN-7525	MicroFET™	PCB Land Pattern Design and Surface Mount Guidelines for MicroFET™ Packages
AN-7526	MicroFET™	Single Channel MicroFET™ 3x2 Power MOSFET Recommended Land Pattern and Thermal Performance
AN-7527	MicroFET™	Dual Channel MicroFET™ 3x2 Power MOSFET Recommended Land Pattern and Thermal Performance
AN-7528	aGeneral	(TB334) Guidelines for Soldering Surface Mount Components to PC Boards
AN-9036	aGeneral	Guidelines for Using Fairchilds Power56
AN-9037	MLP	Assembly Guidelines for 8x8 MLP DriverMOS Packaging
AN-9040	aGeneral	Assembly Guidelines for Power33 Packaging
AN-9045	WL-CSP	WLCSP Assembly Guidelines
AN-9046	aGeneral	Assembly Guidelines for Dual Power56 Packaging
AN-9047	MLP	Assembly Guidelines for MicroFET-6 Packaging
AN-9048	MLP	Assembly Guidelines for Fairchilds 6x6 DriverMOS Packaging
AN-9049	SO-8	Assembly Guidelines for Fairchilds TinyBuck™ Packaging
AN-9056	Dual Cool™ MOSFETs	Using Fairchild Semiconductor Dual Cool™ MOSFETs
AN-9746	MicroFET™ 1.6x1.6mm	Assembly Guidelines for MicroFET™ 1.6x1.6mm Packaging
AN-9747	MicroFET™ 1.6x1.6mm	Assembly Guidelines for MicroFET™ 1.6x1.6mm Dual Packaging
AN-8030	TinyLogic®	TinyLogic® MicroPak2™ Package Applications Guide
AN-9055	MicroFET™	Assembly Guidelines for MicroFET™ 2x2 Dual Packaging
AN-9071	SPM®	Smart Power Module Motion-SPM™ in µMini DIP SPM® Thermal Performance Information
AN-9072	SPM®	Smart Power Module Motion-SPM™ in µMini DIP SPM® Mounting Guidance
AN-5067	MLP	PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages
AN-1100	aGeneral	Thermal Considerations of Surface Mount Packages
AN-6060	aGeneral	Guidelines on Leadforming, Trimming Lead Length, and Heatsink Mounting
MS-554	BGA	BGA Tape and Reel Specifications
MS-501	Surface Mount	Surface Mount Tape-and-Reel Specification