Motion SPM™ Device Portfolio
Note: The 'XX' in the part numbers (FNA4XX) indicates current rating (Ic at Tc = 25 C); e.g. FNA41560B2: Ic = 15A.
Targets high power applications up to 75A/600V. Sense-IGBT’s on low-side for over-current protection and a built- in thermistor for temperature monitoring. 15A – 30A modules in ceramic substrate packaging. 50A and 75A modules in Direct Bond Copper (DBC) substrate packaging to reduce thermal impedance. Input gate signals are active low.
FSAMxxSM: SM indicates mid switching frequency and low conduction loss.
FSAMxx SH: SH indicates high switching frequency and low switching loss.
Targets a wide range of power applications from 3A to 30A/600V. Input gate signals are active high.
SPM3 V2 requires external pin connections between Vs and U/V/W output respectively.
FSBSxxCHxx: S indicates ceramic substrate packaging for the 3A, 5A, 10A, 15A, and 25A modules.
FSBBxxCHxx: B indicates Direct Bond Copper (DBC) substrate packaging for the 15A, 20A, and 30A modules.
SMP3 V4 has an internal connection for Vs, built-in bootstrap diodes and over-temperature protection.
FSBFxxCHxxB: F and B indicate Full Pack substrate for 3A, 5A, 10A, and 15 A.
FSBBxxCHxxC: B and C indicate Direct Bond Copper substrate packaging for 15A, 20A, and 30A modules.
Targets cost sensitive applications below 20A in ceramic substrate packaging with built-in bootstrap diodes. Input gate signals are active high. The SPM45H is divided into two groups:
FNA has lower conduction loss and is recommended for around 5 kHz switching frequency applications.
FNB has lower switching loss and is recommended for around 15 kHz switching applications.
Targets compact lower power motor control applications below 200W; e.g. fan, water pump. The SPM5 has six MOSFET’s and half-bridge gate driver IC’s. 500V, 250V, and 60V modules are available. Input gate signals are active high.
|