| General Information |
| Device Marking(TOP MARK) | &E&Y
&Z2N&D
.&
| |
| Family Code | 051 | |
| Package Type | SC70-6 | |
| Package Description | 006, PLASTIC MOLDED SC70-6 LEAD PACKAGE, SMD | |
| Pin Count | 6 | |
| FIT | 2.7 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 100 | V |
| ESD Machine Model (MM) | 40 | V |