| General Information |
| Device Marking(TOP MARK) | $Y&Z&4&K
74AC257PC
|
| Family Code | 08C |
| Package Type | DIP |
| Package Description | 016,PLASTIC, MOLDED DIP (16 1/2 LEAD) |
| Pin Count | 16 |
| FIT | 2.5 |
| Maximum Reflow Temperature | NA (thru hole) |
| MSL Rating | NA (thru hole)| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Zinc,Silver |
| Lead Pitch | 2540 |
| Minimum Lead Spacing | 760 |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | NA |
| DAP Size | 80X80 MIL |
| Frame Material | Cu |
| Wire Material | Au |
| Wire Diameter | 0.9 MIL |
| Die Attach Type | Epoxy / Poly 6 |
|
|
| UL Flammability Rating | UL94-V0 |
