74ACT00MTCX

Quad 2-Input NAND Gate

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y&Z&2&K ACT00
Family Code	041
Package Type	TSSOP
Package Description	014,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC
Pin Count	14
FIT	2.9
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu (Penang); Matte Sn (Carsem, ATP)
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Lead Pitch	650
Minimum Lead Spacing	350
Die Fabrication
Fabrication Process Identifier	TBD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn
Moisture Sensitivity	1
DAP Size	1.5X1.5MM
Frame Material	Cu
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	0.8 MIL

*If an attribute is listed twice, either can be used on the part.