| General Information |
| Device Marking(TOP MARK) | $Y&Z&4&K
74ACT04PC
| |
| Family Code | 08C | |
| Package Type | DIP | |
| Package Description | 014,PLASTIC, MOLDED DIP | |
| Pin Count | 14 | |
| FIT | 2.5 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Zinc,Silver | |
| Die Fabrication |
| Fabrication Process Identifier | 8C680CSMCD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 134 | °C/Watt |
| Thermal Impedance (Theta JC) | 44 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | 5500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 350 | V |
| Package Assembly* |
| DAP Size | 65X65 MIL | |
| Frame Material | Cu194 | |
| Wire Material | Au | |
| Wire Diameter | 0.9 MIL | |
| Die Attach Type | Epoxy / Poly 6 | |
|
|
| UL Flammability Rating | UL94-V0 | |
