|  |
| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
74ACT1284
| | Family Code | 08C | | Package Type | SOIC-Wide | | Package Description | 020, PLASTIC MOLDED SOIC-20 LD PKG, WIDE BODY, SMD | | Pin Count | 20 | | FIT | 2.5 | | Maximum Reflow Temperature | 260C | | MSL Rating | 1-Penang, 3-ATP| | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | 1 | |
|
| UL Flammability Rating | UL94-V0 | | DAP Size | 110X140 MIL | | Frame Material | Cu | | Die Attach Type | Epoxy / Poly 6 | | Wire Material | Au | | Wire Diameter | 0.9 MIL |
*If an attribute is listed twice, either can be used on the part.
back to top
|
