| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
74ACT16244
| |
| Family Code | 08J | |
| Package Type | SSOP | |
| Package Description | 048,PLASTIC, SHRINK SMALL OUTLINE | |
| Pin Count | 48 | |
| FIT | 1.3 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 2| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt),Silver | |
| Lead Pitch | 650 | |
| Minimum Lead Spacing | 350 | |
| Die Fabrication |
| Fabrication Process Identifier | TBD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 1 | V |
| ESD Charged Device Model (CDM) | 1 | V |
| Package Assembly* |
| Die Attach Type | Epoxy / CRM-1064L | |
| Wire Material | Au | |
| Wire Diameter | 1.3 MIL | |
| DAP Size | 3.5X4.2 MM | |
| Frame Material | Cu | |
