| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
74ACT16244
|
| Family Code | 08J |
| Package Type | SSOP |
| Package Description | 048,PLASTIC, SHRINK SMALL OUTLINE |
| Pin Count | 48 |
| FIT | 1.3 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 2| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt),Silver |
| Lead Pitch | 650 |
| Minimum Lead Spacing | 350 |
| Die Fabrication |
| Fabrication Process Identifier | TBD |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |
| Die Attach Type | Epoxy / CRM-1064L |
| DAP Size | 3.5X4.2 MM |
| Frame Material | Cu |
| Wire Material | Au |
| Wire Diameter | 1.3 MIL |
