| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
ACT374
|
| Family Code | 08C |
| Package Type | SSOP |
| Package Description | 020,SHRINK SO, 5.3 MM WIDE, .65 PCH, EIAJ |
| Pin Count | 20 |
| FIT | 2.5 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver |
| Lead Pitch | 650 |
| Minimum Lead Spacing | 350 |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |