| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
ACT74
|
| Family Code | 08C |
| Package Type | TSSOP |
| Package Description | 014,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC |
| Pin Count | 14 |
| FIT | 2.5 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu (Penang); Matte Sn (Carsem, ATP) |
| Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Silver |
| Lead Pitch | 650 |
| Minimum Lead Spacing | 350 |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn |
| Moisture Sensitivity | 1 |
|
|
| UL Flammability Rating | UL94-VO |
| Die Attach Type | Epoxy / QMI 519 |
| DAP Size | 2.0 Sq |
| Frame Material | Mat |
| Wire Material | Au |
| Wire Diameter | 0.8 MIL |
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