| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
74ACT74
|
| Family Code | 08C |
| Package Type | SOIC |
| Package Description | 014, PLASTIC MOLDED SOIC-14 LD PKG, NARROW BODY, SMD |
| Pin Count | 14 |
| FIT | 2.5 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver |
| Lead Pitch | 1270 |
| Minimum Lead Spacing | 760 |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |
|
|
| UL Flammability Rating | UL94-V0 |
| Die Attach Type | Epoxy / Poly 6 |
| Wire Material | Au |
| Wire Diameter | 0.9 MIL |
| DAP Size | 80x100 MIL |
| Frame Material | Cu |
