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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
74F139
| | | Family Code | 08M | | | Package Type | SOP | | | Package Description | 016,PLAS,MOLDED EIAJ SO | | | Pin Count | 16 | | | FIT | 2.9 | | | Maximum Reflow Temperature | 260C | | | MSL Rating | 1| | | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Die Fabrication | | Fabrication Process Identifier | 8M6FSLM | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 6000 | V | | Package Assembly* | |
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| UL Flammability Rating | UL94-V0 | | | DAP Size | 80X80 MIL | | | Frame Material | Cu | | | Die Attach Type | Epoxy / Poly 6 | | | Wire Material | Au | | | Wire Diameter | 0.9 MIL | |
*If an attribute is listed twice, either can be used on the part.
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