74LCX574WM

Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K LCX574
Family Code	07K
Package Type	SOIC-Wide
Package Description	020, PLASTIC MOLDED SOIC-20 LD PKG, WIDE BODY, SMD
Pin Count	20
FIT	1.4
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Die Fabrication
Fabrication Process Identifier	LVC80C
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	120	°C/Watt
Thermal Impedance (Theta JC)	37	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	3500	V
ESD Charged Device Model (CDM)	2000	V
ESD Machine Model (MM)	300	V
Package Assembly*
UL Flammability Rating	UL94-VO
Die Attach Type	Epoxy / Poly 6
Wire Material	Au
Wire Diameter	1.0 MIL
DAP Size	110X140 MIL
Frame Material	Cu

*If an attribute is listed twice, either can be used on the part.