| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
LVTH32245
| |
| Family Code | 0W2 | |
| Package Type | BGA | |
| Package Description | 96BALL,FBGA,JEDEC MO-205 | |
| Pin Count | 96 | |
| FIT | 1.1 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 3| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | SnAgCu | |
| Die Fabrication |
| Fabrication Process Identifier | W26CBIHY | |
| Package Assembly* |
| Plating Finish Layer Thickness | N/A | |
| Moisture Sensitivity | 3 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 2000 | V |
| ESD Charged Device Model (CDM) | 3000 | V |
| ESD Machine Model (MM) | 300 | V |