74LVX161284MTDX

Low Voltage IEEE 161284 Translating Transceiver

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y&Z&2&K LVX161284
Family Code	0RF
Package Type	TSSOP
Package Description	048,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC
Pin Count	48
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu (Penang); Matte Sn (ATP)
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Lead Pitch	500
Minimum Lead Spacing	230
Die Fabrication
Fabrication Process Identifier	TBD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn
Moisture Sensitivity	2
Wire Material	Au
Wire Diameter	1.0 MIL
Die Attach Type	Epoxy / QMI 519
DAP Size	3.0X4.5MM
Frame Material	Cu

*If an attribute is listed twice, either can be used on the part.