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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
LVX245
| | Family Code | 08P | | Package Type | SOIC-Wide | | Package Description | 020, PLASTIC MOLDED SOIC-20 LD PKG, WIDE BODY, SMD | | Pin Count | 20 | | FIT | 1.9 | | Maximum Reflow Temperature | 260C | | MSL Rating | 1-Penang, 3-ATP| | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | 1 | |
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| UL Flammability Rating | UL94-V0 | | DAP Size | 110X140 MIL | | Frame Material | Cu | | Die Attach Type | Epoxy / Poly 6 | | Wire Material | Au | | Wire Diameter | 1.0 MIL |
*If an attribute is listed twice, either can be used on the part.
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