|  |
| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
LVX541
| | | Family Code | 08P | | | Package Type | SOP | | | Package Description | 020,PLAS,MOLDED EIAJ SO | | | Pin Count | 20 | | | FIT | 1.9 | | | Maximum Reflow Temperature | 260C | | | MSL Rating | 1| | | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 4000 | V | | Package Assembly* | |
|
| UL Flammability Rating | UL94-V0 | | | DAP Size | 110X130 MIL | | | Frame Material | Cu | | | Wire Material | Au | | | Wire Diameter | 0.9 MIL | | | Die Attach Type | Epoxy / Poly 6 | |
*If an attribute is listed twice, either can be used on the part.
back to top
|
