| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
LVXC3245
|
| Family Code | 08G |
| Package Type | SOIC-Wide |
| Package Description | 024, PLASTIC MOLDED SOIC-24 LD PKG, WIDE BODY, SMD |
| Pin Count | 24 |
| FIT | 1.1 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1-Penang, 2-Unisem, 3-ATP| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver |
| Lead Pitch | 1270 |
| Minimum Lead Spacing | 760 |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |
| DAP Size | 120X150 MIL |
| Frame Material | Cu |
|
|
| UL Flammability Rating | UL94-V0 |
| Wire Material | Au |
| Wire Diameter | 1.0 MIL |
| Die Attach Type | Epoxy / Poly 6 |
