74VCX16244MTD

Low Voltage 16-Bit Buffer/Line Driver with 3.6V Tolerant Inputs and Outputs

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K VCX16244
Family Code	08D
Package Type	TSSOP
Package Description	048,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC
Pin Count	48
FIT	1.3
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu (Penang); Matte Sn (ATP)
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Lead Pitch	500
Minimum Lead Spacing	230
Die Fabrication
Fabrication Process Identifier	TBD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn
Moisture Sensitivity	2
Electrical Test
ESD Human Body Model (HBM)	7000	V
Package Assembly*
DAP Size	3.0X4.5MM
Frame Material	Cu
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	1.0 MIL

*If an attribute is listed twice, either can be used on the part.