| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
VCX16839
|
| Family Code | 0M6 |
| Package Type | TSSOP |
| Package Description | 056,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC |
| Pin Count | 56 |
| FIT | 5.9 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 2| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu (Penang); Matte Sn (ATP) |
| Base Metal/Leadframe Material | Copper,Nickel,Magnesium,Silicon,Silver |
| Lead Pitch | 500 |
| Minimum Lead Spacing | 230 |
| Die Fabrication |
| Fabrication Process Identifier | TBD |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn |
| Moisture Sensitivity | 2 |
| Wire Material | Au |
| Wire Diameter | 1.0 MIL |
| Die Attach Type | Epoxy / QMI 519 |
| DAP Size | 3.5X5.0MM |
| Frame Material | Cu |
