| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
V02
| |
| Family Code | 08P | |
| Package Type | TSSOP | |
| Package Description | 014,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC | |
| Pin Count | 14 | |
| FIT | 1.9 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu (Penang); Matte Sn (Carsem, ATP) | |
| Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Silver | |
| Lead Pitch | 650 | |
| Minimum Lead Spacing | 350 | |
| Die Fabrication |
| Fabrication Process Identifier | 8P680C | |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn | |
| Thermal Impedance (Theta JA) | 159 | °C/Watt |
| Thermal Impedance (Theta JC) | 59 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 3500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 200 | V |
| Package Assembly* |
|
|
| UL Flammability Rating | UL-94V0 | |
| DAP Size | 1.5X1.5MM | |
| Frame Material | Cu | |
| Die Attach Type | Epoxy / QMI 519 | |
| Wire Material | Au | |
| Wire Diameter | 0.8 MIL | |
