| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
VHC161284
|
| Family Code | 06E |
| Package Type | TSSOP |
| Package Description | 048,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC |
| Pin Count | 48 |
| FIT | 35.3 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 2| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu (Penang); Matte Sn (ATP) |
| Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Silver |
| Lead Pitch | 500 |
| Minimum Lead Spacing | 230 |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn |
| Moisture Sensitivity | 2 |
| Die Attach Type | Epoxy / QMI 519 |
| Wire Material | Au |
| Wire Diameter | 1.0 MIL |
| DAP Size | 3.0X4.5MM |
| Frame Material | Cu |
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