74VHC175MTC

Quad D-Type Flip-Flop

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y&Z&2&K V175
Family Code	041
Package Type	TSSOP
Package Description	016,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC
Pin Count	16
FIT	2.9
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Lead Pitch	650
Minimum Lead Spacing	350
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au
Moisture Sensitivity	1
DAP Size	HD
Frame Material	2.0 SQ
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	0.8 MIL

*If an attribute is listed twice, either can be used on the part.