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| General Information | | Device Marking(TOP MARK) | $Y&Z&4&K&P
74VHCT08AN
| | Family Code | 08P | | Package Type | DIP | | Package Description | 014,PLASTIC, MOLDED DIP | | Pin Count | 14 | | FIT | 1.9 | | Maximum Reflow Temperature | NA (thru hole) | | MSL Rating | NA (thru hole)| | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Zinc,Silver | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | NA | | Wire Material | Au | | Wire Diameter | 1.0 MIL | | DAP Size | 65X65 MIL | | Frame Material | Cu194 | |
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| UL Flammability Rating | UL94-V0 | | Die Attach Type | Epoxy / Poly 6 |
*If an attribute is listed twice, either can be used on the part.
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