| General Information |
| Device Marking(TOP MARK) | &E&Y
L4P
| |
| Family Code | 05D | |
| Package Type | SOT-23 | |
| Package Description | 003, PLASTIC MOLDED, SOT-23 STD-PRO PKG1, SMD (49) | |
| Pin Count | 3 | |
| FIT | 9.5 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Iron,Nickel,Manganese,Cobalt,Silicon,Silver | |
| Lead Pitch | 1910 | |
| Minimum Lead Spacing | 1500 | |
| Die Fabrication |
| Fabrication Process Identifier | KAP1 | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 8000 | V |
| ESD Charged Device Model (CDM) | 1000 | V |
| ESD Machine Model (MM) | TBD | V |
| Package Assembly* |
|
|
| UL Flammability Rating | UL94-V0 | |
| DAP Size | 36X32 MIL | |
| Frame Material | A42HH | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
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