BAW56
High Conductance Ultra Fast Diode
Test Standards: - Moisture Sensitivity: 1
- Thermal Impedance: 999/999
- Physical Dimensions: SOT-23
- ESD CDM: 2000
| General Information | | Device Marking(TOP MARK) | &Y
A1
| | | Family Code | 050 | | | Package Type | SOT-23 | | | Package Description | 003, PLASTIC MOLDED, SOT-23 STD-PRO PKG2, SMD (49) | | | Pin Count | 3 | | | FIT | 3.3 | | | Maximum Reflow Temperature | 260C | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Base Metal/Leadframe Material | Iron,Nickel,Manganese,Cobalt,Silicon,Silver | | | Lead Pitch | 1910 | | | Minimum Lead Spacing | 1500 | | | Die Fabrication | | Fabrication Process Identifier | 2P49 | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Charged Device Model (CDM) | 2000 | V | | Package Assembly* | |
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| UL Flammability Rating | UL94-V0 | | | DAP Size | 36X32 MIL | | | Frame Material | A42HH | |
*If an attribute is listed twice, either can be used on the part.
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