CNY174M

6-Pin DIP High BVceo Phototransistor Output Optocoupler

Test Standards:

Attribute	Value	UOM
General Information
Family Code	0PC
Package Type	DIP-W
Package Description	6LD, MDIP,OPTO,WHITE,.300 WIDE
Pin Count	6
FIT	8.5
Maximum Reflow Temperature	NA (thru hole)
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Silver
Lead Pitch	2540
Minimum Lead Spacing	760
Die Fabrication
Fabrication Process Identifier	H11AXM
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	1	°C/Watt
Thermal Impedance (Theta JC)	1	°C/Watt
Moisture Sensitivity	NA
Electrical Test
ESD Human Body Model (HBM)	1	V
ESD Charged Device Model (CDM)	1	V
ESD Machine Model (MM)	1	V

*If an attribute is listed twice, either can be used on the part.