| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
1539B
| |
| Family Code | 0BM | |
| Package Type | MLP | |
| Package Description | 6LD, MLP, JEDEC, MO-229, DUAL, 3MM SQUARE | |
| Pin Count | 6 | |
| Die Size X | 55 | MLL |
| Die Size Y | 79 | MLL |
| FIT | 16.4 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu | |
| Die Fabrication |
| Fabrication Process Identifier | BMBCH5 | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 4000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | NA | V |
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