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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
2106MP
C3
| | | Family Code | 096 | | | Package Type | MLP 5x6 | | | Package Description | 25LD,MLP,JEDEC MO-220,QUAD,6X5MM,TRIPLE DAP | | | Pin Count | 25 | | | FIT | 16.9 | | | Die Fabrication | | Fabrication Process Identifier | CS80CBIH30V | | | Package Assembly* | | Thermal Impedance (Theta JA) | 35 | °C/Watt | | Thermal Impedance (Theta JC) | 4 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 2000 | V | | ESD Charged Device Model (CDM) | 2000 | V | | ESD Machine Model (MM) | 200 | V | | Package Assembly* | | DAP Size | 25L | | | Frame Material | 0.65P | | | Die Attach Type | Epoxy / EN-4620K | | | Wire Material | Au | | | Wire Diameter | 1.5 MIL | | | Wire Material | Au | | | Wire Diameter | 1.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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