FAN3100TMPX

Single 2A High-Speed, Low-Side Gate Driver

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&Y &O100T &.&O&V
Family Code	01G
Package Type	MLP
Package Description	6LD,MLP,DUAL,JEDEC MO-229,2MM SQUARE
Pin Count	6
FIT	30.7
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Die Fabrication
Fabrication Process Identifier	BCD5122B
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	75	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	4500	V
ESD Charged Device Model (CDM)	1000	V
Package Assembly*
DAP Size	2X2 MM
Wire Material	Au
Wire Diameter	1.3 MIL
Die Attach Type	Epoxy / EN-4620K

*If an attribute is listed twice, either can be used on the part.