FAN3111ESX

Single 1A High-Speed, Low-Side Gate Driver

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&E&Y &O111E&C &.&O&E&V
Family Code	01G
Package Type	SOT-23
Package Description	005, PLASTIC MOLDED SOT23-5 LEAD PKG, SMD
Pin Count	5
FIT	30.7
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt)
Lead Pitch	950
Minimum Lead Spacing	450
Die Fabrication
Fabrication Process Identifier	BCD5122B
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	235	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	2000	V
ESD Charged Device Model (CDM)	2500	V
Package Assembly*
DAP Size	52X43 MIL
Frame Material	A194FH
UL Flammability Rating	UL94-V0

*If an attribute is listed twice, either can be used on the part.