FAN3121CMPX

Single 9A High-Speed Low-Side Gate Driver

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K 3121C
Family Code	01G
Package Type	MLP
Package Description	8LD, MLP DUA, JEDEC, MO-229,3MM SQUARE
Pin Count	8
FIT	30.7
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Die Fabrication
Fabrication Process Identifier	BCD5122B
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	150	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Charged Device Model (CDM)	2500	V
Package Assembly*
DAP Size	3X3 MM
Die Attach Type	Epoxy / EN-4620K
Wire Material	Au
Wire Diameter	1.5 MIL

*If an attribute is listed twice, either can be used on the part.