FAN4010IL6X_F113

High-Side Current Sense Amplifier

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	PX
Family Code	0N4
Package Type	MicroPak
Package Description	6LD, MICROPAK MLP, 1.0MM X 1.45MM (PREMOLDED)
Pin Count	6
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Base Metal/Leadframe Material	Cu with NiPdAu
Lead Pitch	650
Minimum Lead Spacing	350
Die Fabrication
Fabrication Process Identifier	FS50BC5S
Package Assembly*
Plating Finish Layer Thickness	0.5um - 1.5um Au
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	9000	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
Wire Material	Au
Wire Diameter	0.8 MIL
DAP Size	6L
Frame Material	1.45X1.0MM

*If an attribute is listed twice, either can be used on the part.