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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
FAN4803
CP1
| | Family Code | 0MP | | Package Type | DIP | | Package Description | 008,PLASTIC, MOLDED DIP | | Pin Count | 8 | | Maximum Reflow Temperature | NA (thru hole) | | MSL Rating | NA (thru hole)| | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | | Lead Pitch | 2540 | | Minimum Lead Spacing | 760 | | Die Fabrication | | Fabrication Process Identifier | 16V_BICMOS | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | NA |
*If an attribute is listed twice, either can be used on the part.
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