| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
5009MP
C1
| |
| Family Code | 096 | |
| Package Type | MLP | |
| Package Description | 8LD, MLP, JEDEC, MO-220, DUAL, 5X6MM .160X.140DAP | |
| Pin Count | 8 | |
| FIT | 16.9 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu | |
| Die Fabrication |
| Fabrication Process Identifier | 96CS80CBI/HY | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 105 | °C/Watt |
| Thermal Impedance (Theta JC) | 4 | °C/Watt |
| Moisture Sensitivity | 2 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 1250 | V |
| ESD Charged Device Model (CDM) | 1600 | V |
| ESD Machine Model (MM) | 100 | V |
| Package Assembly* |
| DAP Size | 8L | |
| Frame Material | 4.52X3.81MM | |
| Die Attach Type | Epoxy / EN-4620K | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
