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| General Information | | Die Revision Level | Z | | | Device Marking(TOP MARK) | $Y&Z&2&K
50FC3MP
C
| | | Family Code | 096 | | | Package Type | MLP | | | Package Description | 32LD,MLP,QUAD,JEDEC MO-220, 5MM SQUARE | | | Pin Count | 32 | | | Die Size X | 2000 | MC | | Die Size Y | 4000 | MC | | FIT | 16.9 | | | Die Fabrication | | Fabrication Process Identifier | 96CS80CBI/HY | | | Package Assembly* | | Moisture Sensitivity | 2 | | | Electrical Test | | ESD Human Body Model (HBM) | 1200 | V | | ESD Charged Device Model (CDM) | 1500 | V | | ESD Machine Model (MM) | 100 | V | | Package Assembly* | | DAP Size | 32L | | | Frame Material | 3.694Sq MM | | | Die Attach Type | Epoxy / EN-4620K | | | Wire Material | Au | | | Wire Diameter | 1.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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