| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
5236MTC
C
| |
| Family Code | 096 | |
| Package Type | TSSOP | |
| Package Description | 028, PLASTIC, TSSOP 4.4MM W, JEDEC | |
| Pin Count | 28 | |
| Die Size X | 76 | MLL |
| Die Size Y | 98 | MLL |
| FIT | 16.9 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Silver | |
| Die Fabrication |
| Fabrication Process Identifier | W86CBIH30V | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 2 | |
| DAP Size | 3.5X3.0MM | |
| Frame Material | Cu | |
| Die Attach Type | Epoxy / Poly 6 | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
|
|
| UL Flammability Rating | UL94-V0 | |
