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FAN5350MPX
3MHz 600mA DC/DC Buck Converter in WLCSP and MLP package

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Qualification Data

Fairchild Product Reliability Report

     Contact your regional quality and reliability representative with any questions on product qualification support.

    Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: MLP
  • ESD HBM: 4500
  • ESD CDM: 2000
  • ESD MM: 200

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This pagePrint version



AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&2&K
5350
C
 
Family Code0BM 
Package TypeMLP 
Package Description6LD, MLP, JEDEC, MO-229, DUAL, 3MM SQUARE 
Pin Count6 
FIT16.4 
Maximum Reflow Temperature260C 
MSL Rating1| 
Restriction of Hazardous Substance
Standard Plating FinishNiPdAu 
Die Fabrication
Fabrication Process IdentifierNYFS50BC5S 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Moisture Sensitivity1 
Electrical Test
ESD Human Body Model (HBM)4500V
ESD Charged Device Model (CDM)2000V
ESD Machine Model (MM)200V
Package Assembly*
DAP Size6L 
Frame Material2.51X1.74MM 
Die Attach TypeEpoxy / EN-4620K 
Wire MaterialAu 
Wire Diameter1.0 MIL 

*If an attribute is listed twice, either can be used on the part.

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