FAN5350MPX

3MHz 600mA DC/DC Buck Converter in WLCSP and MLP package

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K 5350 C
Family Code	052
Package Type	MLP
Package Description	6LD,MLP, DUAL JEDEC MO-229,3MM SQUARE, EXTENDED DAP
Pin Count	6
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Die Fabrication
Fabrication Process Identifier	FS50BC5S
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	4500	V
ESD Charged Device Model (CDM)	2000	V
ESD Machine Model (MM)	200	V
Package Assembly*
DAP Size	6L
Frame Material	2.51X1.74MM
Wire Material	Au
Wire Diameter	1.0 MIL
Die Attach Type	Epoxy / EN-4620K

*If an attribute is listed twice, either can be used on the part.