FAN5350MPX
3MHz 600mA DC/DC Buck Converter in WLCSP and MLP package
Test Standards: - Moisture Sensitivity: 1
- Physical Dimensions: MLP
- ESD HBM: 4500
- ESD CDM: 2000
- ESD MM: 200
| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
5350
C
| | | Family Code | 052 | | | Package Type | MLP | | | Package Description | 6LD,MLP, DUAL JEDEC MO-229,3MM SQUARE, EXTENDED DAP | | | Pin Count | 6 | | | Maximum Reflow Temperature | 260C | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | NiPdAu | | | Die Fabrication | | Fabrication Process Identifier | FS50BC5S | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 4500 | V | | ESD Charged Device Model (CDM) | 2000 | V | | ESD Machine Model (MM) | 200 | V | | Package Assembly* | | DAP Size | 6L | | | Frame Material | 2.51X1.74MM | | | Wire Material | Au | | | Wire Diameter | 1.0 MIL | | | Die Attach Type | Epoxy / EN-4620K | |
*If an attribute is listed twice, either can be used on the part.
|