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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
53500
C
| | | Family Code | 0BM | | | Package Type | MLP | | | Package Description | 10LD, MLP, DUAL, 3MM SQUARE | | | Pin Count | 10 | | | FIT | 16.4 | | | Die Fabrication | | Fabrication Process Identifier | BM650BCFL3B | | | Package Assembly* | | Thermal Impedance (Theta JA) | 49 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 3500 | V | | ESD Charged Device Model (CDM) | 1500 | V | | ESD Machine Model (MM) | 50 | V | | Package Assembly* | | DAP Size | 10L | | | Frame Material | 2.700X1.900MM | | | Die Attach Type | Epoxy / EN-4620K | | | Wire Material | Au | | | Wire Diameter | 1.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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