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| General Information | | Device Marking(TOP MARK) | D2&K
&.&2&Z
| | | Family Code | 0BM | | | Package Type | WL-CSP | | | Package Description | 12BALL,TYPE1 WLCSP, 3X4 ARRAY,.5MM PITCH, GENERIC DRAWING | | | Pin Count | 12 | | | Die Size X | 55 | MLL | | Die Size Y | 79 | MLL | | FIT | 16.4 | | | Die Fabrication | | Fabrication Process Identifier | BM650BCFL3B | | | Package Assembly* | | Thermal Impedance (Theta JA) | 110 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 3500 | V | | ESD Charged Device Model (CDM) | 1500 | V | | ESD Machine Model (MM) | 50 | V |
*If an attribute is listed twice, either can be used on the part.
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