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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
602
C1 5
| | Family Code | 052 | | Package Type | MLP | | Package Description | 8LD, MLP DUA, JEDEC, MO-229,3MM SQUARE | | Pin Count | 8 | | Maximum Reflow Temperature | 260C | | MSL Rating | 1| | | Restriction of Hazardous Substance | | Standard Plating Finish | NiPdAu | | Die Fabrication | | Fabrication Process Identifier | 52FS50BC5S | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | 1 | | DAP Size | 3X3 MM | | Die Attach Type | Epoxy / EN-4620K | | Wire Material | Au | | Wire Diameter | 1.0 MIL |
*If an attribute is listed twice, either can be used on the part.
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