| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
5632
C
| |
| Family Code | 0BM | |
| Package Type | MLP | |
| Package Description | 10LD, MLP, DUAL, 3MM SQUARE | |
| Pin Count | 10 | |
| FIT | 16.4 | |
| Die Fabrication |
| Fabrication Process Identifier | BMFS50BC5S | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 60 | °C/Watt |
| Thermal Impedance (Theta JC) | 8 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 2500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 200 | V |
| Package Assembly* |
| DAP Size | 10L | |
| Frame Material | 2.447X1.747MM | |
| Die Attach Type | Epoxy / EN-4620K | |
| Wire Material | Au | |
| Wire Diameter | 1.3 MIL | |
