| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
5645MP
C
| |
| Family Code | 0BM | |
| Package Type | MLP | |
| Package Description | 6LD, MLP, JEDEC, MO-229, DUAL, 3MM SQUARE | |
| Pin Count | 6 | |
| FIT | 16.4 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu | |
| Die Fabrication |
| Fabrication Process Identifier | BM6FS50BPOA | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 7000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| Package Assembly* |
| DAP Size | 6L | |
| Frame Material | 2.51X1.74MM | |
| Die Attach Type | Epoxy / EN-4620K | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
