| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
6520AM
C
|
| Family Code | 096 |
| Package Type | SO-8 |
| Package Description | 008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1) |
| Pin Count | 8 |
| FIT | 16.9 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver |
| Lead Pitch | 1270 |
| Minimum Lead Spacing | 760 |
| Die Fabrication |
| Fabrication Process Identifier | 966CBIH30V |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |
| Die Attach Type | Epoxy / 84-1LMISR4 |
| Wire Material | Au |
| Wire Diameter | 1.0 MIL |
| DAP Size | 3.56X2.41 MM |
| Frame Material | Cu |
|
|
| UL Flammability Rating | UL94-V0 |
