FAN6754MRMY

Highly Integrated Green-Mode PWM Controller

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K 6754MR MYB
Family Code	0GA
Package Type	SOIC
Package Description	008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1)
Pin Count	8
FIT	250
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Silver
Lead Pitch	1270
Minimum Lead Spacing	760
Die Fabrication
Fabrication Process Identifier	BSMH
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	150	°C/Watt
Thermal Impedance (Theta JC)	39	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	4500	V
ESD Charged Device Model (CDM)	1500	V
Package Assembly*
DAP Size	3.56X2.41 MM
Frame Material	Cu
Wire Material	Au
Wire Diameter	1.0 MIL

*If an attribute is listed twice, either can be used on the part.