FAN7313MX
LCD BACKLIGHT INVERTER DRIVE IC
Test Standards: - Moisture Sensitivity: 1
- Thermal Impedance: 18/70
- Physical Dimensions: SOIC-Wide
- ESD HBM: 3000
- ESD CDM: 500
- ESD MM: 300
| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
FAN7313
| | | Family Code | 0SB | | | Package Type | SOIC-Wide | | | Package Description | 020, PLASTIC MOLDED SOIC-20 LD PKG, WIDE BODY, SMD | | | Pin Count | 20 | | | FIT | 6.6 | | | Maximum Reflow Temperature | 260C | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Die Fabrication | | Fabrication Process Identifier | AR7313M | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Thermal Impedance (Theta JA) | 70 | °C/Watt | | Thermal Impedance (Theta JC) | 18 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 3000 | V | | ESD Charged Device Model (CDM) | 500 | V | | ESD Machine Model (MM) | 300 | V | | Package Assembly* | |
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| UL Flammability Rating | UL94-V0 | | | Wire Material | Au | | | Wire Diameter | 1.0 MIL | | | Die Attach Type | Epoxy / Poly 6 | | | DAP Size | 110X140 MIL | | | Frame Material | Cu | |
*If an attribute is listed twice, either can be used on the part.
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