| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FAN7535
| |
| Family Code | 024, PLASTIC MOLDED SOIC-24 LD PKG, WIDE BODY, SMD | |
| Package Type | SOIC-Wide | |
| Pin Count | 24 | |
| Max Power Dissipation | Y | |
| FIT | Epoxy,Die Attach,Poly 6,Hitachi,50G/Jar | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1-Penang, 2-Unisem, 3-ATP| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | |
| Lead Pitch | 1270 | |
| Minimum Lead Spacing | 760 | |
| Die Fabrication |
| Fabrication Process Identifier | CS80CBIH30V | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 3 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 1000 | V |
| ESD Charged Device Model (CDM) | 1000 | V |
