FAN7535MX

Electronic Ballast PFC Combo IC

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FAN7535
Family Code	0SB
Package Type	SOIC-Wide
Package Description	024, PLASTIC MOLDED SOIC-24 LD PKG, WIDE BODY, SMD
Pin Count	24
FIT	6.6
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Silver
Lead Pitch	1270
Minimum Lead Spacing	760
Die Fabrication
Fabrication Process Identifier	CS80CBIH30V
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Moisture Sensitivity	3
Electrical Test
ESD Human Body Model (HBM)	1000	V
ESD Charged Device Model (CDM)	1000	V
Package Assembly*
DAP Size	180X220 MIL
Frame Material	Cu
Wire Material	Au
Wire Diameter	1.0 MIL
UL Flammability Rating	UL94-V0
Die Attach Type	Epoxy / Poly 6

*If an attribute is listed twice, either can be used on the part.