| General Information |
| Device Marking(TOP MARK) | 7711
&E&E&3
| |
| Family Code | 0SB | |
| Package Type | SOIC | |
| Package Description | 008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1) | |
| Pin Count | 8 | |
| FIT | 6.6 | |
| Die Fabrication |
| Fabrication Process Identifier | HDG4 | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 200 | °C/Watt |
| Thermal Impedance (Theta JC) | 38 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 1000 | V |
| ESD Charged Device Model (CDM) | 500 | V |
| ESD Machine Model (MM) | 300 | V |
| Package Assembly* |
| Die Attach Type | Epoxy / 84-1LMISR4 | |
| DAP Size | 3.56X2.41 MM | |
| Frame Material | Cu | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
