FAN7711M

Electronic Ballast Control IC

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	7711 &E&Z&2&K
Family Code	0SB
Package Type	SOIC
Package Description	008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1)
Pin Count	8
FIT	6.6
Die Fabrication
Fabrication Process Identifier	HDG4
Package Assembly*
Thermal Impedance (Theta JA)	200	°C/Watt
Thermal Impedance (Theta JC)	38	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	1000	V
ESD Charged Device Model (CDM)	500	V
ESD Machine Model (MM)	300	V
Package Assembly*
DAP Size	3.56X2.41 MM
Frame Material	Cu
Wire Material	Au
Wire Diameter	1.0 MIL
Die Attach Type	Epoxy / 84-1LMISR4

*If an attribute is listed twice, either can be used on the part.